<html><head><style> body {height: 100%; color:#000000; font-size:12pt; font-family:Times New Roman;}</style></head><body>Desde: 20-12-2012<br>Hasta: 21-12-2012<br>Lugar: <span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US">Beijing, China </span></span></span></span></span><p style="text-align:center;margin:0cm 0cm 0pt;mso-line-height-alt:13.5pt;mso-pagination:widow-orphan;mso-outline-level:1;" class="MsoNormal" align="center"><a name="OLE_LINK11"><span style="mso-bookmark:OLE_LINK8;"><strong><span style="color:#cc0000;font-size:18pt;mso-bidi-font-size:12.0pt;mso-font-kerning:0pt;" lang="EN-US"><span style="font-family:'Times New Roman';">CALL FOR PAPERS</span></span></strong></span></a></p><p style="text-align:center;line-height:13.5pt;margin:0cm 0cm 0pt;mso-pagination:widow-orphan;" class="MsoNormal" align="center"><span style="mso-bookmark:OLE_LINK11;"><span style="mso-bookmark:OLE_LINK8;"><span style="font-size:10pt;mso-font-kerning:0pt;" lang="EN-US"><br></span></span></span><a href="https://www.easychair.org/conferences/?conf=icccit2011" target="_blank"></a><a name="OLE_LINK9"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><strong style="mso-bidi-font-weight:normal;"><span style="color:black;font-size:12pt;" lang="EN-US"><span style="font-family:'Times New Roman';">2012 International Conference on Advanced Material and Manufacturing Science (ICAMMS 2012)</span></span></strong></span></span></a></p><p style="text-align:center;margin:0cm 0cm 0pt;" class="MsoNormal" align="center"><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:red;mso-bidi-font-size:10.5pt;" lang="EN-US">indexed by <strong>EI Compendex</strong> and <strong>Thomson ISI Proceedings(ISTP).</strong></span></span></span><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:red;mso-bidi-font-size:10.5pt;" lang="EN-US"></span></span></span></span></span></p><p style="text-align:center;margin:0cm 0cm 0pt;" class="MsoNormal" align="center"><a href="http://www.icamms-conf.org/" target="_blank"><span style="color:#0000ff;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><strong style="mso-bidi-font-weight:normal;"><span style="font-size:12pt;mso-ansi-language:DE;" lang="DE">http://www.icamms-conf.org/</span></strong></span></span></span></span></a></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><a href="https://www.easychair.org/conferences/?conf=icccit2011" target="_blank"></a><a href="https://www.easychair.org/conferences/?conf=icccit2011" target="_blank"></a><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US">The 2012 International Conference on Advanced Material and Manufacturing Science (ICAMMS 2012) will be held in Beijing, China during December 20-21, 2012. ICAMMS 2012 is one of the leading international conferences for presenting novel and fundamental advances in the fields of Material and Manufacturing Science. The purpose of the conference is for the scientists, scholars, engineers and students from the universities and the research institutes all around the world to present ongoing research activities, and hence to foster research relations. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish research or business relations and to find global partners for future collaboration. It also serves to foster communication among researchers and practitioners working in a wide variety of scientific areas with a common interest in improving Material and Manufacturing Science related techniques.2</span></span></span><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:black;font-size:10pt;" lang="EN-US"></span></span></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:black;font-size:10pt;" lang="EN-US"> </span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US">ICAMMS 2012 ONLY accepts unpublished research papers. Submitted conference papers will be reviewed by technical committees of the Conference. Each paper should be at least 4 pages or longer. Shorter papers should not be included in the proceedings. All accept papers will be published in international journal </span><strong><span style="color:red;" lang="EN-US">Advanced Materials Research (ISSN: 1022-6680)</span><span style="color:black;" lang="EN-US">, </span></strong><span style="color:black;" lang="EN-US">which are online available in full text via the platform </span></span></span></span></span><a href="http://www.scientific.net/" target="_blank"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;font-size:12pt;" lang="EN-US">www.scientific.net</span></span></span></span></a><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US">. All accept papers will be indexed by</span><span style="color:red;" lang="EN-US"><strong>EI Compendex</strong></span><span style="color:black;" lang="EN-US"> and </span><strong><span style="color:red;" lang="EN-US">Thomson ISI Proceedings (ISTP).</span></strong></span></span><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:black;font-size:10pt;" lang="EN-US"></span></span></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US"><span style="font-size:small;font-family:'Times New Roman';"> </span></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US">Advanced Materials Research (ISSN: 1022-6680) is Indexed by Elsevier: SCOPUS </span></span></span></span></span><a href="http://www.scopus.com/" target="_blank"><span style="color:#0000ff;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-size:12pt;" lang="EN-US">www.scopus.com</span></span></span></span></span></a><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US"> and Ei Compendex (CPX) </span></span></span></span></span><a href="http://www.ei.org/" target="_blank"><span style="color:#0000ff;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-size:12pt;" lang="EN-US">www.ei.org/</span></span></span></span></span></a><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US">. Cambridge Scientific Abstracts (CSA) </span></span></span></span></span><a href="http://www.csa.com/" target="_blank"><span style="color:#0000ff;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-size:12pt;" lang="EN-US">www.csa.com</span></span></span></span></span></a><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US">, Chemical Abstracts (CA) </span></span></span></span></span><a href="http://www.cas.org/" target="_blank"><span style="color:#0000ff;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-size:12pt;" lang="EN-US">www.cas.org</span></span></span></span></span></a><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US">, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) </span></span></span></span></span><a href="http://www.isinet.com/" target="_blank"><span style="color:#0000ff;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-size:12pt;" lang="EN-US">www.isinet.com</span></span></span></span></span></a><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US">, Institution of Electrical Engineers (IEE) </span></span></span></span></span><a href="http://www.iee.org/" target="_blank"><span style="color:#0000ff;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-size:12pt;" lang="EN-US">www.iee.org</span></span></span></span></span></a><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US">, etc.p</span></span></span><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:black;font-size:10pt;" lang="EN-US"></span></span></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:black;font-size:10pt;" lang="EN-US"> </span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US">Topics of interest include, but are not limited to:</span></span></span><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:black;font-size:10pt;" lang="EN-US"></span></span></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><strong><span style="color:black;" lang="EN-US">(1) Materials Science and Engineering</span></strong></span></span><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:black;font-size:10pt;" lang="EN-US"></span></span></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="font-size:small;"><span style="font-family:'Times New Roman';"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><strong><span style="color:black;" lang="EN-US">(2) Materials Properties, Measuring Methods and Applications </span></strong></span></span><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:black;font-size:10pt;" lang="EN-US"></span></span></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><strong><span style="color:black;" lang="EN-US"><span style="font-size:small;font-family:'Times New Roman';">(3) Methodology of Research and Analysis and Modelling</span></span></strong></span></span><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:black;font-size:10pt;" lang="EN-US"> </span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><strong><span style="color:black;" lang="EN-US"><span style="font-size:small;font-family:'Times New Roman';">(4) Materials Manufacturing and Processing</span></span></strong></span></span><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:black;font-size:10pt;" lang="EN-US"> </span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><strong><span style="color:black;" lang="EN-US"><span style="font-size:small;font-family:'Times New Roman';">(5) MEMS, NANO, and Smart Systems-on-Chip</span></span></strong></span></span><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;mso-bidi-font-size:10.5pt;" lang="EN-US"><br></span><strong><span style="color:black;" lang="EN-US"><span style="font-size:small;font-family:'Times New Roman';">Important Date</span></span></strong></span></span><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="font-family:'Helvetica','sans-serif';color:black;font-size:10pt;" lang="EN-US"></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US"><span style="font-size:small;"><span style="font-family:'Times New Roman';">Paper Submission (Full Paper) Before August 10, 2012</span></span></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US"><span style="font-size:small;"><span style="font-family:'Times New Roman';">Notification of Acceptance On August 25, 2012</span></span></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US"><span style="font-size:small;"><span style="font-family:'Times New Roman';">Final Paper Submission Before September 10, 2012</span></span></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US"><span style="font-size:small;"><span style="font-family:'Times New Roman';">ICAMMS 2012 Conference Dates December 20-21, 2012</span></span></span></span></span></p><p style="margin:auto 0cm;" class="copyright"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><strong><span style="color:black;font-size:10.5pt;mso-bidi-font-size:12.0pt;mso-font-kerning:1.0pt;" lang="EN-US"><span style="font-family:宋体;">SUBMISSION METHODS:</span></span></strong></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US"><span style="font-size:small;font-family:'Times New Roman';">Email: </span></span></span></span><a href="mailto:icamms@vip.163.com" target="_blank"><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;text-decoration:none;text-underline:none;" lang="EN-US"><span style="font-size:small;font-family:'Times New Roman';">icamms@vip.163.com</span></span></span></span></a><span style="mso-bookmark:OLE_LINK8;"><span style="mso-bookmark:OLE_LINK11;"><span style="color:black;" lang="EN-US"><span style="font-size:small;"><span style="font-family:'Times New Roman';"> ( .pdf and .doc)</span></span></span></span></span></p><p style="margin:auto 0cm;" class="copyright"><strong><span style="color:black;font-size:10.5pt;mso-bidi-font-size:12.0pt;mso-font-kerning:1.0pt;" lang="EN-US"><span style="font-family:宋体;">Conference General Contact </span></span></strong></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="color:black;" lang="EN-US"><span style="font-size:small;"><span style="font-family:'Times New Roman';">Dr. Zheng </span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="color:black;" lang="EN-US"><span style="font-size:small;font-family:'Times New Roman';">E-mail: </span><a href="mailto:icamms@vip.163.com" target="_blank"><span style="color:black;text-decoration:none;text-underline:none;"><span style="font-size:small;font-family:'Times New Roman';">icamms@vip.163.com</span></span></a><span style="font-size:small;"><span style="font-family:'Times New Roman';"></span></span></span></p><p style="margin:0cm 0cm 0pt;" class="MsoNormal"><span style="color:black;" lang="EN-US"><span style="font-size:small;"><span style="font-family:'Times New Roman';">Tel: +86-10-6625-0765 </span></span></span></p><p style="text-align:center;margin:0cm 0cm 0pt;" class="MsoNormal" align="center"><strong style="mso-bidi-font-weight:normal;"><span style="font-size:12pt;mso-ansi-language:DE;" lang="DE"><a href="http://www.icamms-conf.org/" target="_blank"><span style="color:#0000ff;font-family:'Times New Roman';">http://www.icamms-conf.org/</span></a></span></strong></p></body></html>