[NotiAMCA] First Circular of ICTPMCS-2010!
Victorio Sonzogni
sonzogni en intec.unl.edu.ar
Mar Nov 3 20:06:47 ART 2009
Victorio:
Te envÃo información de congreso internacional en Shangai a
cuyo Comité CientÃfico pertenezco, para que lo divulguen por NOTIAMCA.
Gracias, abrazo.
Gustavo Sanchez Sarmiento
----- Original Message -----
From: ICTPMCS-2010
Sent: Tuesday, November 03, 2009 9:23 AM
Subject: First Circular of ICTPMCS-2010!
4th INTERNATIONAL CONFERENCE ON
THERMAL PROCESS MODELING AND COMPUTER SIMULATION (ICTPMCS-2010)
31 May – 2 June 2010, Shanghai, China
(http://www.ictpmcs2010.sjtu.edu.cn)
Dear colleague,
Please find the attached First Circular of
4th INTERNATIONAL CONFERENCE ON THERMAL PROCESS MODELING AND COMPUTER
SIMULATION (ICTPMCS-2010),
31 May – 2 June 2010, Shanghai, China.
The ICTPMCS conference series being organized by Shanghai Jiao Tong
University (SJTU) started in 2000 and from that time is a very important
moment to foster research on the Modeling and Simulation of Materials
Process, to promote related international cooperation among scientists and
engineers and to provide means for the public dissemination of the results
from these efforts.
Since some people ask the final date be extended, the organizing committee
has decided to postpone the registration and abstract date.
Extended Date for Submission of Registration and Abstract: 30 November 2009
For more details, please visit the website:
http://www.ictpmcs2010.sjtu.edu.cn
We warmly expect that your participation will greatly enhance the profile of
the conference. Please fill in the Registration Form and Abstract as
attached and send us before 30 November 2009.
IMPORTANT DEADLINES
First circular
Advance registration 31 Aug. 2009
Abstracts submission 30 Nov. 2009 (extended)
Acceptance of abstracts 30 Nov. 2009
Second circular
Registration 28 Feb. 2010
Payment of registration fee 31 Mar. 2010
Full manuscripts submission 30 Apr. 2010
Final announcement 30 Apr. 2010
Conference opening 31 May 2010
Please feel free to contact us if you have any questions.
P. S.: If you have already submitted the abstract, please forgive sending
this mail to you.
Sincerely yours,
Prof. Jianfeng GU
On behalf of
Secretariat of ICTPMCS-2010
School of Materials Science & Engineering
Shanghai Jiao Tong University
Tel.: +86-21-34203743; -54745526
Fax: +86-21-54745526
E-mail: gujf en sjtu.edu.cn; ictpmcs2010 en gmail.com
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